Monolithic structures including alignment and/or retention fixtures for accepting components

ABSTRACT

Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.

RELATED APPLICATIONS

[0001] This application claims benefit of U.S. Provisional PatentApplication No. 60/415,374, filed Oct. 1, 2002. This prior applicationis incorporated herein by reference as if set forth in full.

FIELD OF THE INVENTION

[0002] Embodiments of this invention relate to precision alignmentand/or retention structures that may be used to align and/or retainmultiple components in desired locations relative to one another orrelative to other components that are fixed in position relative to thealignment structure. More particularly some embodiments relates toalignment and/or retention structures that can be prototyped ormanufactured using, at least in part, a multi-layer electrodepositiontechnique known as Electrochemical Fabrication.

BACKGROUND

[0003] A technique for forming three-dimensional structures (e.g. parts,components, devices, and the like) from a plurality of adhered layerswas invented by Adam L. Cohen and is known as ElectrochemicalFabrication. It is being commercially pursued by Microfabrica Inc.(formerly MEMGen® Corporation) of Burbank, Calif. under the name EFAB™.This technique was described in U.S. Pat. No. 6,027,630, issued on Feb.22, 2000. This electrochemical deposition technique allows the selectivedeposition of a material using a unique masking technique that involvesthe use of a mask that includes patterned conformable material on asupport structure that is independent of the substrate onto whichplating will occur. When desiring to perform an electrodeposition usingthe mask, the conformable portion of the mask is brought into contactwith a substrate while in the presence of a plating solution such thatthe contact of the conformable portion of the mask to the substrateinhibits deposition at selected locations. For convenience, these masksmight be generically called conformable contact masks; the maskingtechnique may be generically called a conformable contact mask platingprocess. More specifically, in the terminology of Microfabrica Inc. ofBurbank, Calif. such masks have come to be known as INSTANT MASKS™ andthe process known as INSTANT MASKING™ or INSTANT MASK™ plating.Selective depositions using conformable contact mask plating may be usedto form single layers of material or may be used to form multi-layerstructures. The teachings of the '630 patent are hereby incorporatedherein by reference as if set forth in full herein. Since the filing ofthe patent application that led to the above noted patent, variouspapers about conformable contact mask plating (i.e. INSTANT MASKING) andelectrochemical fabrication have been published:

[0004] (1) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and P.Will, “EFAB: Batch production of functional, fully-dense metal partswith micro-scale features”, Proc. 9th Solid Freeform Fabrication, TheUniversity of Texas at Austin, p161, Aug.1998.

[0005] (2) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and P.Will, “EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect RatioTrue 3-D MEMS”, Proc. 12th IEEE Micro Electro Mechanical SystemsWorkshop, IEEE, p244, Jan 1999.

[0006] (3) A. Cohen, “3-D Micromachining by ElectrochemicalFabrication”, Micromachine Devices, March 1999.

[0007] (4) G. Zhang, A. Cohen, U. Frodis, F. Tseng, F. Mansfeld, and P.Will, “EFAB: Rapid Desktop Manufacturing of True 3-D Microstructures”,Proc. 2nd International Conference on Integrated MicroNanotechnology forSpace Applications, The Aerospace Co., Apr.1999.

[0008] (5) F. Tseng, U. Frodis, G. Zhang, A. Cohen, F. Mansfeld, and P.Will, “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructuresusing a Low-Cost Automated Batch Process”, 3rd International Workshop onHigh Aspect Ratio Microstructure Technology (HARMST'99), June 1999.

[0009] (6) A. Cohen, U. Frodis, F. Tseng, G. Zhang, F. Mansfeld, and P.Will, “EFAB: Low-Cost, Automated Electrochemical Batch Fabrication ofArbitrary 3-D Microstructures”, Micromachining and MicrofabricationProcess Technology, SPIE 1999 Symposium on Micromachining andMicrofabrication, September 1999.

[0010] (7) F. Tseng, G. Zhang, U. Frodis, A. Cohen, F. Mansfeld, and P.Will, “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructuresusing a Low-Cost Automated Batch Process”, MEMS Symposium, ASME 1999International Mechanical Engineering Congress and Exposition, November,1999.

[0011] (8) A. Cohen, “Electrochemical Fabrication (EFABTM)”, Chapter 19of The MEMS Handbook, edited by Mohamed Gad-EI-Hak, CRC Press, 2002.

[0012] (9) “Microfabrication—Rapid Prototyping's Killer Application”,pages 1-5 of the Rapid Prototyping Report, CAD/CAM Publishing, Inc.,June 1999.

[0013] The electrochemical deposition process may be carried out in anumber of different ways as set forth in the above patent andpublications. In one form, this process involves the execution of threeseparate operations during the formation of each layer of the structurethat is to be formed:

[0014] 1. Selectively depositing at least one material byelectrodeposition upon one or more desired regions of a substrate.

[0015] 2. Then, blanket depositing at least one additional material byelectrodeposition so that the additional deposit covers both the regionsthat were previously selectively deposited onto, and the regions of thesubstrate that did not receive any previously applied selectivedepositions.

[0016] 3. Finally, planarizing the materials deposited during the firstand second operations to produce a smoothed surface of a first layer ofdesired thickness having at least one region containing the at least onematerial and at least one region containing at least the one additionalmaterial.

[0017] After formation of the first layer, one or more additional layersmay be formed adjacent to the immediately preceding layer and adhered tothe smoothed surface of that preceding layer. These additional layersare formed by repeating the first through third operations one or moretimes wherein the formation of each subsequent layer treats thepreviously formed layers and the initial substrate as a new andthickening substrate.

[0018] Once the formation of all layers has been completed, at least aportion of at least one of the materials deposited is generally removedby an etching process to expose or release the three-dimensionalstructure that was intended to be formed.

[0019] The preferred method of performing the selectiveelectrodeposition involved in the first operation is by conformablecontact mask plating. In this type of plating, one or more conformablecontact (CC) masks are first formed. The CC masks include a supportstructure onto which a patterned conformable dielectric material isadhered or formed. The conformable material for each mask is shaped inaccordance with a particular cross-section of material to be plated. Atleast one CC mask is needed for each unique cross-sectional pattern thatis to be plated.

[0020] The support for a CC mask is typically a plate-like structureformed of a metal that is to be selectively electroplated and from whichmaterial to be plated will be dissolved. In this typical approach, thesupport will act as an anode in an electroplating process. In analternative approach, the support may instead be a porous or otherwiseperforated material through which deposition material will pass duringan electroplating operation on its way from a distal anode to adeposition surface. In either approach, it is possible for CC masks toshare a common support, i.e. the patterns of conformable dielectricmaterial for plating multiple layers of material may be located indifferent areas of a single support structure. When a single supportstructure contains multiple plating patterns, the entire structure isreferred to as the CC mask while the individual plating masks may bereferred to as “submasks”. In the present application such a distinctionwill be made only when relevant to a specific point being made.

[0021] In preparation for performing the selective deposition of thefirst operation, the conformable portion of the CC mask is placed inregistration with and pressed against a selected portion of thesubstrate (or onto a previously formed layer or onto a previouslydeposited portion of a layer) on which deposition is to occur. Thepressing together of the CC mask and substrate occur in such a way thatall openings, in the conformable portions of the CC mask contain platingsolution. The conformable material of the CC mask that contacts thesubstrate acts as a barrier to electrodeposition while the openings inthe CC mask that are filled with electroplating solution act as pathwaysfor transferring material from an anode (e.g. the CC mask support) tothe non-contacted portions of the substrate (which act as a cathodeduring the plating operation) when an appropriate potential and/orcurrent are supplied.

[0022] An example of a CC mask and CC mask plating are shown in FIGS.1(a)-1(c). FIG. 1(a) shows a side view of a CC mask 8 consisting of aconformable or deformable (e.g. elastomeric) insulator 10 patterned onan anode 12. The anode has two functions. FIG. 1(a) also depicts asubstrate 6 separated from mask 8. One is as a supporting material forthe patterned insulator 10 to maintain its integrity and alignment sincethe pattern may be topologically complex (e.g., involving isolated“islands” of insulator material). The other function is as an anode forthe electroplating operation. CC mask plating selectively depositsmaterial 22 onto a substrate 6 by simply pressing the insulator againstthe substrate then electrodepositing material through apertures 26 a and26 b in the insulator as shown in FIG. 1(b). After deposition, the CCmask is separated, preferably non-destructively, from the substrate 6 asshown in FIG. 1(c). The CC mask plating process is distinct from a“through-mask” plating process in that in a through-mask plating processthe separation of the masking material from the substrate would occurdestructively. As with through-mask plating, CC mask plating depositsmaterial selectively and simultaneously over the entire layer. Theplated region may consist of one or more isolated plating regions wherethese isolated plating regions may belong to a single structure that isbeing formed or may belong to multiple structures that are being formedsimultaneously. In CC mask plating as individual masks are notintentionally destroyed in the removal process, they may be usable inmultiple plating operations.

[0023] Another example of a CC mask and CC mask plating is shown inFIGS. 1(d)-1(f). FIG. 1(d) shows an anode 12′ separated from a mask 8′that comprises a patterned conformable material 10′ and a supportstructure 20. FIG. 1(d) also depicts substrate 6 separated from the mask8′. FIG. 1(e) illustrates the mask 8′ being brought into contact withthe substrate 6. FIG. 1(f) illustrates the deposit 22′ that results fromconducting a current from the anode 12′ to the substrate 6. FIG. 1(g)illustrates the deposit 22′ on substrate 6 after separation from mask8′. In this example, an appropriate electrolyte is located between thesubstrate 6 and the anode 12′ and a current of ions coming from one orboth of the solution and the anode are conducted through the opening inthe mask to the substrate where material is deposited. This type of maskmay be referred to as an anodeless INSTANT MASK™ (AIM) or as ananodeless conformable contact (ACC) mask.

[0024] Unlike through-mask plating, CC mask plating allows CC masks tobe formed completely separate from the fabrication of the substrate onwhich plating is to occur (e.g. separate from a three-dimensional (3D)structure that is being formed). CC masks may be formed in a variety ofways, for example, a photolithographic process may be used. All maskscan be generated simultaneously, prior to structure fabrication ratherthan during it. This separation makes possible a simple, low-cost,automated, self-contained, and internally-clean “desktop factory” thatcan be installed almost anywhere to fabricate 3D structures, leaving anyrequired clean room processes, such as photolithography to be performedby service bureaus or the like.

[0025] An example of the electrochemical fabrication process discussedabove is illustrated in FIGS. 2(a)-2(f). These figures show that theprocess involves deposition of a first material 2 which is a sacrificialmaterial and a second material 4 which is a structural material. The CCmask 8, in this example, includes a patterned conformable material (e.g.an elastomeric dielectric material) 10 and a support 12 which is madefrom deposition material 2. The conformal portion of the CC mask ispressed against substrate 6 with a plating solution 14 located withinthe openings 16 in the conformable material 10. An electric current,from power supply 18, is then passed through the plating solution 14 via(a) support 12 which doubles as an anode and (b) substrate 6 whichdoubles as a cathode. FIG. 2(a), illustrates that the passing of currentcauses material 2 within the plating solution and material 2 from theanode 12 to be selectively transferred to and plated on the cathode 6.After electroplating the first deposition material 2 onto the substrate6 using CC mask 8, the CC mask 8 is removed as shown in FIG. 2(b). FIG.2(c) depicts the second deposition material 4 as having beenblanket-deposited (i.e. non-selectively deposited) over the previouslydeposited first deposition material 2 as well as over the other portionsof the substrate 6. The blanket deposition occurs by electroplating froman anode (not shown), composed of the second material, through anappropriate plating solution (not shown), and to the cathode/substrate6. The entire two-material layer is then planarized to achieve precisethickness and flatness as shown in FIG. 2(d). After repetition of thisprocess for all layers, the multi-layer structure 20 formed of thesecond material 4 (i.e. structural material) is embedded in firstmaterial 2 (i.e. sacrificial material) as shown in FIG. 2(e). Theembedded structure is etched to yield the desired device, i.e. structure20, as shown in FIG. 2(f).

[0026] Various components of an exemplary manual electrochemicalfabrication system 32 are shown in FIGS. 3(a)-3(c). The system 32consists of several subsystems 34, 36, 38, and 40. The substrate holdingsubsystem 34 is depicted in the upper portions of each of FIGS. 3(a) to3(c) and includes several components: (1) a carrier 48, (2) a metalsubstrate 6 onto which the layers are deposited, and (3) a linear slide42 capable of moving the substrate 6 up and down relative to the carrier48 in response to drive force from actuator 44. Subsystem 34 alsoincludes an indicator 46 for measuring differences in vertical positionof the substrate which may be used in setting or determining layerthicknesses and/or deposition thicknesses. The subsystem 34 furtherincludes feet 68 for carrier 48 which can be precisely mounted onsubsystem 36.

[0027] The CC mask subsystem 36 shown in the lower portion of FIG. 3(a)includes several components: (1) a CC mask 8 that is actually made up ofa number of CC masks (i.e. submasks) that share a common support/anode12, (2) precision X-stage 54, (3) precision Y-stage 56, (4) frame 72 onwhich the feet 68 of subsystem 34 can mount, and (5) a tank 58 forcontaining the electrolyte 16. Subsystems 34 and 36 also includeappropriate electrical connections (not shown) for connecting to anappropriate power source for driving the CC masking process.

[0028] The blanket deposition subsystem 38 is shown in the lower portionof FIG. 3(b) and includes several components: (1) an anode 62, (2) anelectrolyte tank 64 for holding plating solution 66, and (3) frame 74 onwhich the feet 68 of subsystem 34 may sit. Subsystem 38 also includesappropriate electrical connections (not shown) for connecting the anodeto an appropriate power supply for driving the blanket depositionprocess.

[0029] The planarization subsystem 40 is shown in the lower portion ofFIG. 3(c) and includes a lapping plate 52 and associated motion andcontrol systems (not shown) for planarizing the depositions.

[0030] Another method for forming microstructures from electroplatedmetals (i.e. using electrochemical fabrication techniques) is taught inU.S. Pat. No. 5,190,637 to Henry Guckel, entitled “Formation ofMicrostructures by Multiple Level Deep X-ray Lithography withSacrificial Metal layers. This patent teaches the formation of metalstructure utilizing mask exposures. A first layer of a primary metal iselectroplated onto an exposed plating base to fill a void in aphotoresist, the photoresist is then removed and a secondary metal iselectroplated over the first layer and over the plating base. Theexposed surface of the secondary metal is then machined down to a heightwhich exposes the first metal to produce a flat uniform surfaceextending across the both the primary and secondary metals. Formation ofa second layer may then begin by applying a photoresist layer over thefirst layer and then repeating the process used to produce the firstlayer. The process is then repeated until the entire structure is formedand the secondary metal is removed by etching. The photoresist is formedover the plating base or previous layer by casting and the voids in thephotoresist are formed by exposure of the photoresist through apatterned mask via X-rays or UV radiation.

[0031] Electrochemical Fabrication provides the ability to formprototypes and commercial quantities of miniature objects, parts,structures, devices, and the like at reasonable costs and in reasonabletimes. In fact, Electrochemical Fabrication is an enabler for theformation of many structures that were hitherto impossible to produce.Electrochemical Fabrication opens the design and product spectrum inmany industrial fields. Even though Electrochemical Fabrication offersthis new capability and it is understood that ElectrochemicalFabrication techniques can be combined with designs and structures knownwithin various fields to produce new structures, certain uses forElectrochemical Fabrication provide designs, structures, capabilitiesand/or features not known or obvious in view of the state of the artwithin the field or fields of a specific application.

[0032] A need exists in the field of aligning and/or retainingcomponents, and particularly in the field of precision alignmentstructures and/or retention structures, for enhanced alignment and/orretention methods and structures that can be used to reducemanufacturing costs, enhance reliability of assemblies, reduce theamount of labor, or skilled labor required to align and/or retaincritical components.

SUMMARY OF THE INVENTION

[0033] An object of various aspects of the invention is to provideimproved alignment and/or retention structures for receiving components.

[0034] An object of various aspects of the invention is to provide areduction in manufacturing costs for devices requiring the alignmentand/or retention of various components.

[0035] An object of various aspects of the invention is to provide areduction in skilled labor required to assemble devices havingcomponents that need precise relative alignment and/or retention.

[0036] Other objects and advantages of various aspects of the inventionwill be apparent to those of skill in the art upon review of theteachings herein. The various aspects of the invention, set forthexplicitly herein or otherwise ascertained from the teaching herein, mayaddress any one of the above objects alone or in combination, oralternatively may address some other object of the invention ascertainedfrom the teachings herein. It is not intended that all of these objectsbe addressed by any single aspect of the invention even though that maybe the case with regard to some aspects.

[0037] It is an aspect of the invention to provide an alignment and/orretention structure for receiving a plurality of components, thatincludes a base; a plurality of alignment and/or retention fixturesattached to the base and having desired positions relative to oneanother, wherein one or more of the following conditions are met: (1)the base and the alignment and/or retention fixtures are substantiallymonolithic, (2) the alignment and/or retention fixtures comprise atleast one material deposited on substantially a layer-by-layer basis, or(3) the alignment and/or retention fixtures are formed in a singleprocess in their respective relative positions.

[0038] It is an aspect of the invention to provide a device, thatincludes (a) an alignment and/or retention structure, that includes (1)a base; (2) a plurality of alignment and/or retention fixtures adheredto the base and having desired positions relative to one another; (b) aplurality of components mounted on the alignment structure in positionsdictated by the alignment and/or retention fixtures, wherein one or moreof the following conditions are met: wherein one or more of thefollowing conditions are met: (1) the base and the alignment and/orretention fixtures are monolithic, (2) the alignment and/or retentionfixtures comprise a material deposited on substantially a layer-by-layerbasis, or (3) the alignment and/or retention fixtures are formed in asingle process in their respective relative positions.

[0039] Further aspects of the invention will be understood by those ofskill in the art upon reviewing the teachings herein. Other aspects ofthe invention may involve combinations of the above noted aspects of theinvention. Other aspects of the invention may involve methods and/orapparatus that can be used in implementing one or more of the aboveaspects of the invention. These other aspects of the invention mayprovide various combinations of the aspects presented above as well asprovide other configurations, structures, functional relationships, andprocesses that have not been specifically set forth above.

[0040] Preferred embodiments are directed to permanent or temporaryalignment structures for receiving multiple components. The structuresare preferably formed monolithically via a plurality of depositionoperations (e.g. electrodeposition operations). The structures typicallyinclude two or more positioning features that control or aid in thepositioning of components relative to one another, such features mayinclude (1) positioning guides or stops that fix or at least partiallylimit the positioning of components in one or more orientations ordirections, (2) retention elements that hold positioned components indesired orientations or locations, and (3) positioning and/or retentionelements that receive and hold adjustment modules into which componentscan be fixed and which in turn can be used for fine adjustments ofposition and/or orientation of the components. The structures may alsoinclude elements that bring functionality beyond that of mechanicalalignment and retention. Such functionality may involve electricalfunction, a thermodynamic function, optical or photonic function, and/ora mechanical function. Conductive paths may be provided on a structureto allow off- structure communication as well as on-structurecommunication. On structure communication may occur within singlecomponents, between single components and functional elements, orbetween multiple components with or without intermediate functionalelement enhancements.

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIGS. 1(a)-1(c) schematically depict side views of various stagesof a CC mask plating process, while FIGS. 1(d)-(g) schematically depicta side views of various stages of a CC mask plating process using adifferent type of CC mask.

[0042] FIGS. 2(a)-2(f) schematically depict side views of various stagesof an electrochemical fabrication process as applied to the formation ofa particular structure where a sacrificial material is selectivelydeposited while a structural material is blanket deposited.

[0043] FIGS. 3(a)-3(c) schematically depict side views of variousexample subassemblies that may be used in manually implementing theelectrochemical fabrication method depicted in FIGS. 2(a)-2(f).

[0044] FIGS. 4(a)-4(i) schematically depict the formation of a firstlayer of a structure using adhered mask plating where the blanketdeposition of a second material overlays both the openings betweendeposition locations of a first material and the first material itself.

[0045]FIG. 5(a) depicts a schematic representation of an alignmentand/or retention structure for receiving multiple components wherealignment and/or retention fixtures protrude from a base.

[0046]FIG. 5(b) depicts a schematic representation of an alignmentand/or retention structure for receiving multiple components wherealignment and/or retention fixtures are recessed into a base.

[0047]FIG. 6 depicts a schematic representation of an alignment and/orretention structure for receiving multiple components where somealignment and/or retention fixtures protrude from a base and otheralignment fixtures are recessed into the base.

[0048]FIG. 7 depicts a schematic representation of an alignment and/orretention structure for receiving multiple components where somealignment and/or retention fixtures are located on an upper surface of abase and where other alignment and/or retention fixtures are located ona lower surface of the base.

[0049]FIG. 8 depicts a schematic representation of an alignment and/orretention structure for receiving multiple components where thealignment and/or retention fixtures are located on an upper surface of abase and other alignment and/or retention fixtures are located on thesides of the base.

[0050]FIG. 9 depicts a schematic representation of an alignment and/orretention structure for receiving multiple components where alignmentand/or retention fixtures are stacked upon one another.

[0051]FIG. 10 depicts a schematic representation of an alignment and/orretention structure for receiving multiple components where somealignment and/or retention structures are formed on an upper surface ofthe base and openings extend through the base between its upper andlower surfaces.

[0052] FIGS. 11(a) and 11(b) depict schematic representations ofalignment and/or retention structures for receiving multiple componentswhere the structures include conductive paths and/or other built-infunctional structures or features.

[0053]FIG. 12 depicts a schematic representation of an alignment and/orretention structure for receiving multiple components where thestructure includes a preliminary alignment and/or retention fixture thatcan receive a secondary alignment and/or retention fixture which in turncan receive a component.

[0054]FIG. 13 depicts a perspective view of a first preferredprotruding-type fixture along with a schematic representation of acomponent that can be located thereby.

[0055]FIG. 14 depicts a perspective view of a second preferredprotruding-type fixture along with a schematic representation of acomponent that can be located thereby.

[0056]FIG. 15 depicts a perspective view of a third preferredprotruding-type fixture along with a schematic representation of acomponent located thereby.

[0057]FIG. 16(a) depicts a perspective view of a fourth preferredprotruding-type fixture along with a schematic representation of acomponent located thereby while FIG. 16(b) depicts a side view of thecomponent loaded into and retained by the fixture of FIG. 16(a).

[0058] FIGS. 17(a) and 17(b) depict side views of a fifth preferredprotruding-type fixture along with a schematic representation of acomponent located and retained thereby.

[0059]FIG. 17(c) depicts a side view of several alternative compressivestructures that can be used in an alignment and retention fixture suchas that depicted in FIGS. 17(a) and 17(b).

[0060] FIGS. 18(a) and 18(b) depict perspective views of a seventhprotruding-type fixture along with a schematic representation of acomponent located thereby.

[0061] FIGS. 19(a) and 19(b) depict perspective views of an eighthpreferred protruding-type fixture along with a schematic representationof a component located thereby.

[0062] FIGS. 20(a) and 20(b) depict perspective views of a ninthpreferred protruding-type fixture along with a schematic representationof a component located and retained thereby.

[0063]FIG. 21 depicts a perspective view of a first and second preferredrecessed-type fixture along with a schematic representation of acomponent that can be located thereby.

[0064]FIG. 22 depicts a perspective view of a third preferredrecessed-type fixture along with a schematic representation of acomponent that can be located and retained thereby.

[0065] FIGS. 23(a) and 23(b) depict side views of an fourth preferredrecessed-type fixture along with a schematic representation of acomponent located and retained thereby.

[0066]FIG. 24 depicts a perspective view of a portion of an alignmentand retention structure that includes four variations of fixtures andassociated components where the components may be mounted and then movedrelative to the rest of the structure so that precision positionaladjustments may be made beyond those associated with the initialmounting.

[0067]FIG. 25 depicts a perspective view of a portion of an alignmentand retention structure including a fixture that may be deformed at anintermediate position between a component mounting location and the restof the structure so that the component location may be adjusted relativeto the rest of the structure beyond that associated with the initialmounting of the component.

[0068]FIG. 26(a) and 26(b) depict side views of an alignment andretention structure that includes a fixture having retention elements,guide elements, and electrical contact elements that are independent ofbut positioned relative to the other components of the fixture.

[0069]FIG. 27(a) and 27(b) depict side views of a portion of analternative alignment and retention structure that includes a fixturehaving retention clips that are closed onto the component as thecomponent is loaded into the fixture.

[0070]FIG. 28(a) depicts a variation of the alignment and retentionstructure of FIGS. 27(a) and 27(b) where the moving portion of thefixture engages another portion of the structure to help lock thefixture/component in a retention position.

[0071]FIG. 28(b) depicts a variation of the alignment and retentionstructure of FIGS. 27(a) and 27(b) where the fixture includes outwardfacing levers that may be used to move the structure from a retentionposition to an open position.

[0072] FIGS. 29(a)-29(c) depict perspective views of a device thatcontains an alignment and/or retention structure, components, and apackaging structure having passages for various internal-to-externalconnections.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

[0073] FIGS. 1(a)-1(g), 2(a)-2(f), and 3(a)-3(c) illustrate variousfeatures of one form of electrochemical fabrication that are known.Other electrochemical fabrication techniques are set forth in the '630patent referenced above, in the various previously incorporatedpublications, in various other patents and patent applicationsincorporated herein by reference, still others may be derived fromcombinations of various approaches described in these publications,patents, and applications, or are otherwise known or ascertainable bythose of skill in the art from the teachings set forth herein. All ofthese techniques may be combined with those of the various embodimentsof various aspects of the invention to yield enhanced embodiments. Stillother embodiments may be derived from combinations of the variousembodiments explicitly set forth herein.

[0074] FIGS. 4(a)-4(i) illustrate various stages in the formation of asingle layer of a multi-layer fabrication process where a second metalis deposited on a first metal as well as in openings in the first metalwhere its deposition forms part of the layer. In FIG. 4(a), a side viewof a substrate 82 is shown, onto which patternable photoresist 84 iscast as shown in FIG. 4(b). In FIG. 4(c), a pattern of resist is shownthat results from the curing, exposing, and developing of the resist.The patterning of the photoresist 84 results in openings or apertures92(a)-92(c) extending from a surface 86 of the photoresist through thethickness of the photoresist to surface 88 of the substrate 82. In FIG.4(d), a metal 94 (e.g. nickel) is shown as having been electroplatedinto the openings 92(a)-92(c). In FIG. 4(e), the photoresist has beenremoved (i.e. chemically stripped) from the substrate to expose regionsof the substrate 82 which are not covered with the first metal 94. InFIG. 4(f), a second metal 96 (e.g., silver) is shown as having beenblanket electroplated over the entire exposed portions of the substrate82 (which is conductive) and over the first metal 94 (which is alsoconductive). FIG. 4(g) depicts the completed first layer of thestructure which has resulted from the planarization of the first andsecond metals down to a height that exposes the first metal and sets athickness for the first layer. In FIG. 4(h) the result of repeating theprocess steps shown in FIGS. 4(b)-4(g) several times to form amulti-layer structure are shown where each layer consists of twomaterials. For most applications, one of these materials is removed asshown in FIG. 4(i) to yield a desired 3-D structure 98 (e.g. componentor device).

[0075]FIG. 5(a) depicts a schematic representation of an alignmentand/or retention structure 100 for receiving multiple components wherealignment and/or retention fixtures 104-109 protrude from a base 102. Inthe example of FIG. 5(a), boxes 104-109 represent the six alignmentand/or retention structures that extend from a base plate 102. Thefixtures may be configured, positioned, and oriented for acceptance ofspecifically sized and configured components for loading in specificorders and from specific orientations. As such, the fixtures may havedifferent sizes, orientations, and configurations as exemplified in FIG.5(a). It should be understood (even though not depicted), the fixturesneed not have a rectangular structure but may take on any structuralconfiguration that is appropriate to the component or components to bealigned or retained. In the illustration of FIG. 5(a), all structuralfeatures within the boxes may be considered part of the alignmentstructures themselves while those outside the boxes maybe consideredpart of the base.

[0076]FIG. 5(b) depicts a schematic representation of an alignmentand/or retention structure 110 for receiving multiple components wherealignment fixtures 114-118 are recessed into a base 112. In theillustration of FIG. 5(b) , all structural features within the box-likedepressions may be considered part of the alignment structuresthemselves while those outside the boxes maybe considered part of thebase. As with protruding alignment fixtures recessed alignment fixturesmay take on any appropriate configuration or orientation.

[0077] In some preferred embodiments the base need not have thesubstantially rectangular configurations as shown in the illustrationsof the present applications, the configuration of the base may take onany form appropriate to a given situation. In the present application,the term “base” shall refer to any structure that connects two or morealignment fixtures together (unless more narrowly limited by thecontext) and not just the structural configuration depicted. Forexample, a base may be a single bar-like structure that connects twofixtures; it may be a rigid gird-like structure that connects two ormore fixtures; it may not be planar but may have features that extend inthree dimensions; it may not be a single structure that connects allfixtures but may be in the form of segmented elements that connect aonly a portion of the fixtures; or the surfaces of what might beconsidered part of the fixtures themselves may function as a base ifthose surfaces join other fixtures.

[0078]FIG. 6 depicts a schematic representation of an alignment and/orretention structure 120 for receiving multiple components where somealignment and/or retention fixtures 124 and 126 protrude from a base 122and other alignment and/or retention fixtures 125 and 127 are recessedinto the base 122. In other embodiments, alignment and or retentionfixtures may be of a mixed nature in that a portion of fixtures may berecessed while another portion may protrude from a base.

[0079]FIG. 7 depicts a schematic representation of an alignment and/orretention structure 130 for receiving multiple components where somealignment and/or retention fixtures 133-138 are located on an uppersurface of a base 132 and where other alignment and/or retentionfixtures 143, 144, and 148 are located on a lower surface of the base.

[0080]FIG. 8 depicts a schematic representation of an alignment and/orretention structure 150 for receiving multiple components where thealignment and/or retention fixtures 153 and 154 are located on an uppersurface of a base 152 and other alignment and/or retention fixtures163-169 and 173 are located on the sides of the base. As depictedfixtures 165-168 are recessed into the base, while 163, 164, 169, and173 protrude from a nominal side surface of the base. One or more of thefixtures and most particularly one or more of the side fixtures 163-169,and 173 may be used in aligning the structure with second alignmentand/or retention structure or with a package that is to receive thealignment and/or retention structure. The side fixtures may be usedsolely as alignment guides or may be used for retention purposes aswell. Of course, in some preferred embodiments, side fixtures may takeon different configurations and/or side fixtures may be used inconjunction with the various other alternative fixtures set forthherein. In some embodiments, fixtures on upper or lower surfaces of abase may be used in aligning a first alignment and/or retentionstructures with a second such structure.

[0081]FIG. 9 depicts a schematic representation of another preferredalignment and/or retention structure 180 for receiving multiplecomponents where alignment and/or retention fixtures 184 and 186 arestacked above alignment and/or retention fixtures 183 and 185respectively. Upper fixtures may be supported from lower fixtures (i.e.a portion of the lower fixture functions as a base for the upperfixture) as illustrated in conjunction with fixtures 184 and 183 orupper fixtures may be supported directly from extensions of thealignment fixture or extensions that protrude from the base asillustrated by extensions 187 a-187 c that support or at least helpsupport fixture 186 directly from base 182. Of course, in alternativeembodiments fixtures may be stacked within recesses that extend into thebase and may also include further stacking above the base. In stillother embodiments fixturing elements may be included as part of thepackaging of previously loaded components. In some embodiments heatconductive pastes and the like may be used to achieve desired componentto base properties.

[0082]FIG. 10 depicts a schematic representation of an alignment and/orretention structure 190 for receiving multiple components where somealignment and/or retention fixtures 193 and 194 are formed on an uppersurface of a base 192 and openings 195 and 196 extend through the basefrom an upper to a lower surface. The openings that extend through thebase may serve several functions: (1) they may include componentalignment or retention fixtures for receiving components, such as whencomponent placement and loading order requires loading of componentsfrom both sides, (2) they may form passageways through the base thatallow communication of signals or material flow between upper and lowerregions, e.g. optical signals, gas or liquid flow, and the like, or (3)they may perform some other design function, such as reducing materialconsumption, improving manufacturability, providing clearance for otherstructures, and the like. Fixtures and components may be located aboveor below openings. Such locations may aid in production or reception ofsignals or production of, receipt of, directing of, or controlling ofmaterial flow that moves through the opening. The openings through thebase need not be orientated perpendicular to a plane of the base but maybe orientated in any convenient or required manner. The openings mayactually take the form of simple or complex two or three dimensionalpaths (e.g. manifolds and the like) that may direct signals or materialflow in a desired pattern. In the case of EM signal flow, the openingsmay not be physical openings but may be physically obstructed with amedium that allows transmission of the desired signal, e.g. for opticalsignals a glass barrier may be located in the opening, and for RF ormicrowave signals an appropriate dielectrical may be located in awave-guide or coaxial-type transmission line. Such obstructing materialsmay or may not be considered components mounted in a fixture. InParticular they may not be considered components when they are formed orbuilt up along with the formation of the structure itself.

[0083] FIGS. 11(a) and 11(b) depict schematic representations ofalignment and/or retention structures 200 and 210 for receiving multiplecomponents where the structures include conductive paths and/or otherfunctional structures, elements, or devices built into bases 202 and212. FIG. 11(a) depicts alignment and/or retention fixtures 207-209located on the upper surface of base 202. The upper surface of the baseis depicted as having off-structure communicating conductive paths 203 aand 203 b, on-structure component-to-component communicating paths 204a-204 c, and on-structure paths for communicating between differentportions of a single components 205 a-205 c. FIG. 11(b) depictsalignment and/or retention fixtures 217 and 218 located on the uppersurface of base 212. The upper surface of the base 212 is depicted ashaving off-structure communicating conductive paths 213 a and 213 b,on-structure component-to-component communicating paths 214 a-214 d, onstructure paths for communicating between different portions of a singlecomponent 215 a-215 e, and built-in functional elements 219 a-219 g.

[0084] Paths 203 a, 203 b, 213 a, and 213 b allow communication from thecomponents that will be associated with their respective structures todevices or components that are not associated with these respectivestructures. The signals along these paths may take the form of a simplepower input or output, or signal input or output, or some combination ofboth. As path 203 b connects fixtures 207 and 209 and as path 213 bconnects fixtures 217 and 218, on structure communication betweencomponents may also occur.

[0085] As indicated, paths 205 a-205 c and 215 a-215 e make externalconnections between different portions of a single component. This typeof connection may occur within the boundary of an alignment and/orretention fixture or it may extend beyond such a boundary. Suchconnections can be useful for a variety of reasons. As indicated by path215 a and 215 b and also by 215 c and 215 d, such paths may allow theconnection to be made via functional elements such as 219 b and 219 f.These functional elements may be formed along with the formation of thebase and fixtures. These elements/structures may introduce manydifferent functionalities, for example resistance, capacitance,inductance, wave shaping (e.g. coaxial transmission or filtering),testing functionality, or monitoring functionality, and the like.Additional embedded functional elements (such as 219 a) may not beconnected to other structures or components by electrically conductivepaths but instead provide some other functionality such as, for example,production of magnetic fields, enhanced heat flow (e.g. via heat pipes),or enhanced reflectivity.

[0086] In alternative embodiments, the functional elements may beconnected conductively, capacitively, or inductively to off-structuredevices. In still other embodiments the functional elements may beformed on the fixtures instead on the bases. Furthermore, conductivepaths may run partly or completely on or into the alignment and/orretention fixtures. In some embodiments, portions of the base, orsubstantially the entire base, and/or portions of the alignment and/orretention fixtures, or substantially the entire fixtures, may be formedfrom a dielectric material with the exception of the conductive paths orfunctional elements that require conductive materials. In otherembodiments, the bases and the fixtures may be primarily formed from aconductive material with only a relatively thin region of dielectricseparating the conductive paths from the rest of the conductivematerial. In still further alternative embodiments, the conductive pathsand/or functional components may be completely embedded withindielectric portions of the base or within dielectric portions of thefixtures with the exception of those locations where contact must bemade. In other alternative embodiment on surface conducting paths may becoated or otherwise shielded by a dielectric.

[0087]FIG. 12 depicts a schematic representation of an alignment and/orretention structure 230 for receiving multiple components where thestructure includes a preliminary alignment and/or retention fixture 233,in base 232, that can receive a secondary alignment and/or retentionfixture 234 which in turn can receive a component 236. The depictedstructure also contains an additional alignment and/or retention fixture235. In alternative embodiments multiple primary and secondary fixturepairs may exist. In still further embodiments even tertiary or higherorder groups of fixtures may exist. Such fixture groups may be useful toallow height or orientation changes in component fixturing to occur.Such versatility might be helpful in allowing a single alignment and/orretention structure to be used in multiple applications where differingcomponents or numbers of components might be involved. In somealternative embodiments secondary fixtures may allow multiple componentsto be attached. In some other alternative embodiments the secondaryfixtures may make conductive paths that connect to conductive paths onthe primary fixtures.

[0088]FIG. 13 depicts a perspective view of a first preferredprotruding-type alignment (or positioning) fixture 240 along with aschematic representation of a component 249 that can be located thereby.The fixture of FIG. 13 includes four alignment elements 243 a-243 d thathold the corners of component 249. As illustrated, the alignmentelements 243 a-243 d do not necessarily aid in guiding the componentinto the fixture though they do ensure that once the component islowered completely into the fixture it is properly located in allthree-dimensions (assuming the fixture is mounted from below by the basewhose surface functions as part of the fixture). In alternativeembodiments, fewer or more fixturing elements may be used and differentconfigurations (e.g. having different heights and widths) may be used.In particular, if a component has particular features, the fixturingelements may be sized and positioned appropriately to either catch oravoid the features. In still further alternatives, tapering of theinside upper edges of the alignment elements can help guide thecomponent into the fixture and likewise tapering of the lower edges ofthe component can also help in the guiding process. In some alternativeembodiments the fixtures may include vertical stops as well. In thedepicted embodiment frictional forces may be used to help retain thecomponent in the fixture. If it is desired that the component be firmlyaffixed in the fixture, alternative embodiments may use varioustechniques for securing the component and the fixture, for example: (1)a desired type of adhesive may be located between the component and abase (not shown) on which the fixture sits, (2) an adhesive may belocated between the fixture elements and the components, (3) cooling ofthe component and/or heating of fixture may be used to temporarilyincrease or create a desired size differential between the component andthe fixture to allow tightly fitting pieces to be positioned where aftertemperature equalization will cause a more intimate mating and retentionof the pieces; (4) solder or the like may be selectively applied todesired locations (e.g. electrical contact regions) or blanket depositedif shorting is not an issue so that after positioning, melting andresolidification of the solder may cause bonding as well as ensuringreliable electrical contact, (5) other conductive and/or non-conductivemeltable or temporarily flowable or deformable materials may be used ina manner analogous to that noted above for solder, (6) packaging of thecomponent(s)/structure(s) may involve a partial or complete embedding ofthe components in a selected material within a package that includes thestructures, or (7) packaging of the component(s)/structure(s) mayinvolve the used of an enclosure that holds thecomponent(s)/structure(s) together.

[0089]FIG. 14 depicts a perspective view of a second preferredprotruding-type fixture 250 along with a schematic representation of acomponent 259 that can be located thereby. The fixture of FIG. 14includes four alignment elements 253 a-253 d that hold the sides ofcomponent 249. As with FIG. 13, as depicted, the alignment elements 253a-253 d do not necessarily aid greatly in guiding the component into thefixture. The alternatives noted above with regard to FIG. 13 are alsoapplicable to the embodiment illustrated in FIG. 14 and are largelyapplicable to the other embodiments explicitly set forth below as wellas other embodiments that will be apparent to those of skill in the artthat have studied the teachings herein.

[0090] FIGS. 15 depicts a perspective view of a third preferredprotruding-type fixture 260 along with a schematic representation of acomponent 269 that may be located thereby. Fixture elements 263 a-263 dnot only properly locate the component but due to their taperedconfiguration they also can help guide the component into the fixture.In alternative embodiments, the tapering need not be uniform but may begreater at the top of the fixture elements. In alternative embodimentsthe tapering may reduce to nothing as the width of the opening offeredby the alignment structure approaches the width of the component. Insome alternatives, upper surfaces of the bases may function as avertical stop or additional elements or stop features may be consideredpart of the fixture itself.

[0091] FIGS. 16(a) depicts a perspective view of a fourth preferredprotruding-type fixture 270 along with a schematic representation of acomponent 279 located thereby while FIG. 16(b) depicts aside view of thecomponent 279 loaded into and retained by the fixture 270. FIG. 16(a)illustrates a component 279 located above an alignment and retentionfixture. The down-facing arrows 275 a-275 d indicate the movement ofcomponent that may be used to load the component into the fixture. Thefixture 270 includes a perimeter wall 274 and four inward-facing,downward-sloping side retention tabs 273 a-273 d. A portion of the base272 of the alignment structure can also be seen. As the component isloaded into the fixture the tabs 273 a-273 d bend down sufficiently toallow the component to enter the fixture but due to their at leastpartial elastic deformation they exert an inward pointing forces ontothe component which tends to center the component in the fixture andhold the component in place friction between the tabs and componentsinhibit an upward backing out of the component from the fixture.

[0092] In some alternative embodiments, the components may have sets ofside slots that engage the tabs 273 a-273 d, or the like, which may beuseful in helping the desired positions of the component and fixture. Inother alternatives, additional tabs may be used and/or the tab structuremay be varied (e.g. tab width and thickness may vary (e.g. decrease)with length from the perimeter wall 274. In other embodiments, theperimeter wall may be replaced by individual tab supports. In stillother embodiments, the retention tabs may enter indentations in thecomponent side walls to further aid in securing the component into adesired position relative to the alignment/retention structure.

[0093] FIGS. 17(a) and 17(b) depict side views of a fifth preferredprotruding-type fixture 280 along with a schematic representation of acomponent 289 located and retained thereby. The fixture includesretention arms 283 a and 283 b along with compression elements 284 a and284 b. As the component 289 is push down into the fixture, retentionarms 283 a and 283 b are forced open. As the component is pushed deeperinto the fixture, the bottom of the component encounters the compressionelements and pushes them downward. As downward motion continues, theupper portion of the component clears the retention arms 283 a and 283 band they slide inward such that fingers 285 a and 285 b become locatedabove the upper surface of the component. When the downward loadingforce is removed, the compression elements push the component upwardcausing fingers 285 a and 285 b to grasp the upper surface of thecomponent such that the component is firmly held between the retentionarms and compression elements. As illustrated both the retention armsand the compression elements are mounted on or formed integral with abase 282 of the alignment and retention structure.

[0094] In some embodiments one or more of the compression elements maybe electrical conductors and contactors and/or one or more of theretention arms may be electrical conductors and contactors. The elementsthat are electrical contactors may be formed of any desired conductivematerial (e.g. copper or a gold plated material) and they may beconnected to conductive paths on or within the base. In someembodiments, additional structures may be added to aid in guiding thecomponent into the fixture (see for example elements 386 a and 386 b ofFIG. 27(a)). In some embodiments more than two compression springs andretention arms may be used, the springs and arms may be paired orotherwise grouped or there may be different numbers of each. In someembodiments, the compression springs may be configured differently, suchas for example, like those indicated in FIG. 17(c).

[0095]FIG. 17(c) depicts four examples of different alternativeconfigurations 286 a-286 d with each mounted on a base 282′. Each of thealternative configurations depicted in FIG. 17(c) may have a contactregion made from a different material as indicated by elements 287 a-287d (particularly if used as an electrical contactor). In someembodiments, instead of retention arms that hold a component from asurface perpendicular to the loading direction (e.g. top surface)retention tabs (similar to those shown in FIGS. 16a and 16 b) may beused that hold the components on a surface that is more parallel to thedirection of loading (e.g. the side surfaces). In still furtheralternatives a single compression element or retention arm may have morethan one element or finger that contacts the component. In still otherembodiments, components may have slots or indentations on their upperand/or lower surfaces for engaging the fingers and/or compressionelements. In still other embodiments fixtures configurations may be usedthat allow for spring based loading and spring based release. In evenfurther embodiments base 282 may have a hole through it to allow signalor material access to the lower surface of the component.

[0096] FIGS. 18(a) and 18(b) depict perspective views of a seventhprotruding-type fixture 290 along with a schematic representation of acomponent 299 located thereby. In FIG. 18(a) a component 299 is depictedseparate from a two stop 293 a and 293 b alignment fixture 290 that ismounted on a base 292. The component is loaded into the fixture so thattwo of the sides are caught and held by the two stops 293 a and 293 b.The two stops constrain the component in a first direction along both ofthe two horizontal axes and in the vertical direction. A rounding of thebottom of the fingers 294 a and 294 b of stops 293 a and 293 b and/or ofthe upper portion's of the component that engage the stops may lead toeasy loading of the component into the fixture. FIG. 18(b) depicts theloaded fixture/component combination and as described herein elsewhere,various methods may be used to retain the component in the fixture asdesired.

[0097]FIG. 19(a) and 19(b) depict perspective views of an eighthpreferred protruding-type fixture 300 along with a schematicrepresentation of a component 309 located thereby. The alignment fixture300 sits on base 302 and includes two guides 303 a and 30 b along with astop 304 whose upper surface is a hook to constrain vertical movement ofone end of a component 309 that is loaded into the fixture. From theteachings herein various alternative configurations of this embodimentwill be apparent to those of skill in the art. For example, a guideopposite to the stop may be added. FIG. 19(b) depicts the loadedfixture/component combination.

[0098] FIGS. 20(a) and 20(b) depict perspective views of a ninthpreferred protruding-type fixture 310 along with a schematicrepresentation of a component 319 located and retained thereby. Thealignment fixture 310 is attached to a base 312. Though the alignmentfixture protrudes from base 312, it may be considered a recessed fixturein that it includes an opening 314 through a rectangular block 315(particularly if the block is considered to be part of the base). Thealignment fixture 310 also includes retention tabs 313 a-313 d. Theretention tabs are used to hold a component in much the same way theretention tabs of FIGS. 16(a) and 16(b) did. FIG. 20(b) depicts theloaded fixture/component combination. Various alternatives as discussedherein before and herein after may be used in conjunction with thisembodiment.

[0099]FIG. 21 depicts a perspective view of within a base 322 first andsecond preferred recessed-type fixtures 320 a and 320 b respectivelyalong with a schematic representation of components 329 a and 329 b thatcan be located thereby. Fixture 320 b is a simple straight walledfixture which in many respects is similar to the fixtures of FIGS. 13and 14. Fixture 320 a is a sloped wall fixture which in many respects issimilar to the fixture of FIG. 15. The embodiment of fixture 320 a maybe enhanced by modifying the slope of the walls so that, near the uppersurface, the slope is angled or rounded so as to help guide thecomponent into the fixture. As the component moves deeper into thefixture it may encounter more vertical and even completely verticalwalls where the dimension of the opening within the walls is such as toallow accurate positioning and orientation of the component andpotentially to retention of the component as well.

[0100]FIG. 22 depicts a perspective view of a third preferredrecessed-type fixture 330 within a base 332 along with a schematicrepresentation of a component 339 that can be located and retainedthereby. The fixture of FIG. 22 is similar to those of FIGS. 16 and 20awith the exception that the walls surrounding the opening of the fixtureare sloped to help center and ensure proper orientation of the componentonce it is loaded into the fixture. The fixture also includes retentiontabs 333 a-333 d. In some alternative embodiments the fixtures of FIGS.21 and 22 may be supplemented by protruding elements that help guide andorient the component and/or that help retain components in the fixtures.

[0101]FIG. 23(a) and 23(b) depict side views of an fourth preferredrecessed-type fixture 340 along with a schematic representation of acomponent 349 located and retained thereby. Functionally the fixture ofFIGS. 23(a) and 23(b) is similar to that of FIG. 17(a) but severaldistinctions exist. The fixture of FIGS. 23(a) and 23(b) include guidestructures 346 a and 346 b that help ensure the component is properlyoriented and located as it seats against spring elements 344 a and 344 band as it is retained by elements 343 a and 343 b. In FIGS. 23(a) and23(b) spring elements 344 a and 344 b may be electrical contactors thatare isolated from a conductive base 342 by insulators 345 a and 345 b.Some of the elastic nature of spring elements 344 a and 344 b may resultfrom an elastomeric nature of the insulating material of 345 a and 345b. In some alternative embodiments, the base 342 may be formed from adielectric material in which case a dielectrical material 345 a and 345b may not be necessary. In embodiments where the component 349 is an RFor microwave component, conductors 344 a and 344 b surrounded bymaterial 345 a and 345 b and a grounded conductor 342 may function as acoaxial transmission lines for any RF or microwave signals generated. Insome embodiments, the coaxial attributes of the contactors may beextended by extending the dielectric and a surrounding conductive shieldcloser to the ends of conductors 344 a and 344 b. In particular, it ispreferred that the dielectric and conductive shield not detrimentallyreduce the elastomeric nature of conductors 344 a and 344 b.

[0102]FIG. 24 depicts a perspective view of a portion of an alignmentand retention structure that includes four variations of deformablefixtures 350 a-350 d, mounted on a base 352, along with associatedcomponents 359 a-359 d. The components are mounted on elements 353 a,353 b′-353 b′″, 353 c, and 353 d and then moved relative to the rest ofthe structure so that precision positional adjustments may be madebeyond those associated with the initial mounting. Elements 353 a-353 dmay be a solder-like material or other low melting temperature materialand particular a material of sufficiently low softening temperature thatthe material may be deformed without damaging the components 359 a-359d. Component 359 a may be mounted and initially bonded to material 353 aby heating the material. In some embodiments the meltable material maybe formed with or otherwise attached to the base prior to mounting thecomponents. In other embodiments the meltable material may be attachedto the component and thereafter the combination attached to the base.The position of component 359 a may be finely adjusted in all threedimensions and in all orientations by grasping the component andsoftening material 353 a and then adjusting the component's positionwhile monitoring a desired alignment parameter. After the desiredalignment is obtained the material 353 a is cooled and allowed to fixthe component in its desired precision position. If material 353 ashrinkage causes misalignment upon solidification the extent ofmisalignment can be monitored and appropriate offset positioning used sothat final positioning is correct.

[0103] Component 359 b may be similarly adjusted in all three dimensionsand in any orientation. Component 539 c is bounded from below byprotrusions 354 c′ and 354 c″. These protrusions may be used to set thelowest vertical height of the component and the orientation of thecomponent relative to a vertical axis. Upon softening the material 353c, the component may be pushed down against the block (or evenpotentially raised slightly if desired) and then the horizontal positionand orientation may be set. Component 353 d may be moved up and downvertically by softening material 353 d and potentially its orientationwith respect to a vertical axis changed slightly (depending on therestriction dictated by the fixture elements 354 d′-354 d′″) but itshorizontal position and orientation is largely fixed by fixture elements354 d′-354 d′″.

[0104] In some embodiments a single component will be adjustable via asoftenable or meltable material while in other embodiments a givenalignment structure may have multiple components that will be adjustablein such a manner. When multiple components are adjustable in such amanner, and not all such components will be positioned and orientedsimultaneously, then it may be appropriate to tailor the adjustmentprocess to ensure that initial bonding or adjustments of a second orsubsequent component do not disturb the bonding or adjustment orpreviously mounted or finely aligned components. This may be done byusing materials with different softening temperatures and mounting thecomponents and adjusting the components associated with the highestsoftening temperature first. Alternatively, if the heating of thematerial is isolated sufficiently to the alignment element associatedwith a single component, a single material may be used and adjustmentmay occur in any desired order or even in an incremental order. As withthe other embodiments various alternatives will be understood by thoseof skill in the art upon review of the teachings herein.

[0105]FIG. 25 depicts a perspective view of a portion of an alignmentand retention structure including a fixture 360 that is deformable at aposition intermediate to a component mounting location and a base 362 sothat the component location is adjustable relative to the base and, assuch, relative to the rest of the structure. The fixture of FIG. 25includes four legs 363 a-363 d which are located in a rectangularpattern. On top of the legs is a mounting plate 364 and on top of themounting plate an optional softenable material is located. The componentis mounted on the softenable material. A vertical adjustment of thecomponent may be made via the softenable material as noted above withregard to FIG. 24. A horizontal adjustment in a first direction may bemade by bending legs 363 a-363 d at their meeting points with base 362and plate 364 in the direction of arrows 366 a and 366 b and in theother direction by bending the legs in the direction of 367 a and 367 b.In some embodiments, the bending of the legs may be facilitated by anarrowing of the width of the legs at the junction points in thedirection of desired adjustment. Any variation in vertical position thatresults from the bending of the legs may be accommodated by adjustmentsassociated with softening the material 365. In some embodiments, thefixture of FIG. 25 may be made monolithically. In other embodiments,purely mechanical deformations may be used to obtain movement in allthree directions and even in orientation as well. Various alternativesto the adjustable fixture of FIG. 25 are possible. U.S. Pat. No.6,416,937, to Flanders et al., entitled “Optical Component InstallationProcess”, sets forth an installation process using adjustable mountingfixtures. This patent is hereby incorporated herein by reference as ifset forth herein in full.

[0106] FIGS. 26(a) and 26(b) depict side views of an alignment andretention structure that includes a fixture 370 having retentionelements 374 a and 374 b, guide elements 377 a and 377 b, and electricalcontact elements 375 a and 375 b. The electrical contact elements aremounted directly onto a base 372 and are independent of alignmentfixture frame 373 with the exception of their contact at contractors 376a and 376 b with the component 379 when it is loaded into the fixture.FIG. 26(a) shows the component prior to loading it in the fixture whileFIG. 26(b) depicts the component after loading. The alignment andretention features of this embodiment are similar to that of FIGS. 17(a)and 17(b) and FIGS. 23(a) and 23(b) with the exception that both theleft and right sides (the top and bottom relative to FIGS. 17(a) and17(b) and FIGS. 23(a) and 23(b) ) are not blocked or shadowed by aportion of a base or a frame. If component 379 is an optical generationor detection device and if contactors 376 a and 376 b provide electricalinput or output to the same side of the component as its opticallyactive surface, the configuration of the FIGS. 26(a) and 26(b) allowsmounting and use of such a component. Element 378 depicts an opticalpath coming from or going to component 379.

[0107] In some embodiments the conductive elements 375 a and 375 b mayoriginate on frame 373 or may be supported by elements extending fromthe frame 373. In other embodiments, various other configurations of thealignment and retention fixture are possible and will be apparent tothose of skill in the art upon reviewing the teachings herein.

[0108] FIGS. 27(a) and 27(b) depict side views of a portion of analternative alignment and retention structure that includes a fixture380 having retention clips 384 a and 384 b that are closed ontocomponent 389 as the component is loaded into the fixture. The fixtureis attached to a base 382 and includes legs 383 a and 383 b, pivotregions 385 a and 385 b. As indicated by the dashed outlines ofstructures 386 a and 386 b, guide structures may be included in thealignment fixture to ensure that the component is loaded in the fixturewith the right orientation and alignment. In alternative embodiments, noguides may be used or additional guides may be used and the guides mayhave various configurations. As component 389 is loaded into the fixturethe upper portion of the fixture begins to bend inward as the bottom ofthe component contacts the lower portions (i.e. actuation levers) 384 a′and 384 b′ of clips 384 a and 384 b. The bending forward continues untilthe tips 384 a″ and 384 b″ of clips 384 a and 384 b contact theelectrical pads 384 a′″ and 384 b′″. As indicated in FIGS. 27(a) and27(b) , the upper surfaces of the lower portions 384 a′ and 384 b′ maybe roughened, knurled, stair stepped or otherwise patterned to increasethe stability of the matting of the clips and the component. In someembodiments pivot regions may, for example, be bendable joins orrotatable structures.

[0109] Various alternatives to the embodiment of FIGS. 27(a) and 27(b)are possible and will be apparent to those of skill in the art. Twoexamples are illustrated in FIGS. 28(a) and 28(b). In FIG. 28(a) themoving portion 384 a′ and 384 b′ of the fixture 380 engages anotherportion 387 a′ and 387 b′ of the structure via extensions 387 a″ and 387b″ to help lock the fixture/component in a retention position. In someembodiments, structures 387 a′ and 387 b′ and extensions 387 a″ and 387b″ may be of a ratcheted configuration while in other embodiments theymay simply be stair-stepped as depicted. In some embodiments structures387 a′ and 387 b′ may be on elastomeric (e.g. compressible) mounts, ormay be formed from an elastomeric material, to give sufficient retentionforce while still allowing component release and the seating of newcomponents. In still other alternatives extensions 387 a″ and 387 b″ maybe located on a elastomeric structures. In still further alternatives, arelease mechanism may be provided to aid in separating the engagedportions. In FIG. 28(b), the fixture is shown as including outwardfacing levers 388 a and 388 b that may be used to move portions 384 a″and 384 b″ from a retention position to an open position. Many otheralternatives will be apparent to those of skill in the art uponreviewing the disclosure herein.

[0110] FIGS. 29(a)-29(c) depict perspective views of a device thatcontains an alignment and/or retention structure (including fixtures 390a-390 c and a base 392 having alignment structures), components 399 a′,399 a″, 399 b, and 399 c, and a packaging structure 402 and 405 andhaving passages 409 a″ and 409 c. FIG. 29(a) shows components 399 a′ and399 a″, 399 b, and 399 c separated from their respective alignmentfixtures 390 a, 390 b, and 390 c. FIG. 29(b) depicts the componentsmounted on their respective alignment structures. In FIG. 29(c) thecomponent/alignment fixture combination is located between a package lid405 and a package bottom 402 and is ready for mounting into bottom 402via mating alignment marks 393 a-393 d and 403 a-403 d. Component 399 cextends out of the assembled device package via slot 409 c and component399 a″ will extend out of the assembled package via slot 409 a″. The topportions of slots 409 c and 409 a″ will be filled by structures such as405′, that extend from lid 405, once the lid is mounted on the bottom402. In the example of FIGS. 29(a)-29(c) component 399 c may be one ormore fiber optic elements, component 399 b may be a lens, component 399a′ may be a radiation generating component, and component 399 a″ may beone or more electrical signal and/or power feed lines.

[0111] In some embodiments any gaps in the walls of the package (e.g.where the lid is mounted or where the components pass through) may besealed in various manners. For example, sealing may occur via gaskets,sealing compounds, meltable conductive or non-conductive materials. Instill further embodiments, the package may contain pre-sealed vias (forpassing signals between the interior and exterior of a package) withcontact structures that mate with electrical leads or other componentsthat are loaded into the package in much the same way contact betweenalignment fixtures and components is achieved according to the teachingsherein. In some embodiments multiple alignment and/or retentionstructures and associated components may be loaded into a singlepackage. In some embodiments, internal volume of the package may beevacuated, back filled with a desired gas, or even filled with aflowable but settable material. In addition to the packaging embodimentsand alternative set forth above, many other alternatives will beapparent upon review of the teachings herein.

[0112] The components that may be located and or retained by thestructures of various embodiments of the present invention varyconsiderably, for example, the components may include: (1) electricaland electronic components including both active and passive devices, (2)optical and photonic components, (3) temperature control components, and(5) other mechanical and electromechanical devices. The electrical andelectronic components may include, for example, capacitors; inductors;resistors; RF and microwave transmission lines, delay lines, filters,couplers, splitters, and the like; transducers, diodes; transistors;integrated circuits, batteries and other power generation devices,permanent and electromagnets, and the like. Optical and photoniccomponents may include, for example, mirrors, lenses, light sources(e.g. LEDs and lasers), photocells, detectors, fiber optics, filters,windows, and the like. Temperature control components may include, forexample, thermistors, thermal couples, heaters, thermal electriccoolers, heat pipes, thermal electric materials, heat sinks, and thelike. Other mechanical and electromechanical devices include, forexample, fluid flow channels, manifolds, valves, pumps, piezoelectricdevices, pneumatic devices, actuators, springs, alignment fixtures, andthe like.

[0113] In some preferred implementations an Electrochemical Fabricationprocess (EFAB) is used for forming bases, alignment and/or retentionfixtures, and any included functional elements. For example, such aprocess is described above in association with FIGS. 2(a)-2(f). In otherprocesses, additional conductive materials may be used and/or dielectricmaterials may be used to isolate selective conductive regions from oneanother. In still other processes, an initial building substrate may bea dielectric or after formation of all layers of deposited material, thestructure may be swapped from an original substrate to a secondsubstrate which may be a dielectric. In still other processes, chemicalor electrochemical etching may be used to form structures directly or tocreate cavities into which other material may be deposited. Inalternative implementations, an electrochemical extrusion (ELEX) processmay be used to form a structure or a portion of the structure.

[0114] After formation of each layer of a structure, various postprocessing operations may be used to complete formation of the alignmentand/or retention structures. For example, a single etching operation maybe used to remove any sacrificial material, a multi-step etchingoperation may be used to allow more control of the etching process or toallow various intermediate steps or operations to occur, the partiallyformed structure may bonded or otherwise combined with other structures.

[0115] Various alternative production processes that may be used informing alignment and/or retention structures some of which aredescribed in the various publications, patents, and patent applicationincorporated herein by reference.

[0116] Various combinations of the teachings in the above embodimentsand their alternatives are possible and will be understood by those ofskill in the art upon review of the teachings herein. As such,alternatives mentioned explicitly in one embodiment may also haveapplication to other embodiments

[0117] The patent applications in TABLE 1 are hereby incorporated byreference herein as if set forth in full. The gist of each patentapplication is included in the table to aid the reader in findingspecific types of teachings. It is not intended that the incorporationof subject matter be limited to those topics specifically indicated, butinstead the incorporation is to include all subject matter found inthese applications. The teachings in these incorporated applications canbe combined with the teachings of the instant application in many ways.For example, the various apparatus configurations disclosed in thesereferenced applications may be used in conjunction with the novelfeatures of the instant invention to provide various alternativeapparatus that include the functionality disclosed herein: TABLE 1 USApplication No. Title Filing Date Brief Description US App. No.10/434,295 Method of and Apparatus for Forming Three-DimensionalStructures Integral May 7, 2003 With Semiconductor Based CircuitryEnhanced Electrochemical fabrication processes are provided that canform three- dimensional multi-layer structures using semiconductor basedcircuitry as a substrate. Electrically functional portions of thestructure are formed from structural material (e.g. nickel) that adheresto contact pads of the circuit. Aluminum contact pads and siliconstructures are protected from copper diffusion damage by application ofappropriate barrier layers. In some embodiments, nickel is applied tothe aluminum contact pads via solder bump formation techniques usingelectroless nickel plating. In other embodiments, selective electrolesscopper plating or direct metallization is used to plate sacrificialmaterial directly onto dielectric passivation layers. In still otherembodiments, structural material deposition locations are shielded, thensacrificial material is deposited, the shielding is removed, and thenstructural material is deposited. In still other embodiments structuralmaterial is made to attached to non- contact pad regions.. US App. No.10/434,493 Electrochemically Fabricated Structures Having DielectricBases or Active May 7, 2003 Bases and Methods of and Apparatus forProducing Such Structures Multilayer structures are electrochemicallyfabricated (e.g. by EFAB ™) on a temporary conductive substrate and arethere after are bonded to a permanent dielectric substrate and removedfrom the temporary substrate. The structures are formed from top layerto bottom layer, such that the bottom layer of the structure becomesadhered to the permanent substrate. The permanent substrate may be asolid sheet that is bonded (e.g. by an adhesive) to the layeredstructure or the permanent substrate may be a flowable material that issolidified adjacent to or partially surrounding a portion of thestructure with bonding occurs during solidification. The multilayerstructure may be released from a sacrificial material prior to attachingthe permanent substrate or more preferably it may be released afterattachment. US App. No. 10/434,103 Electrochemically FabricatedHermetically Sealed Microstructures and May 7, 2003 Methods of andApparatus for Producing Such Structures Multilayer structures areelectrochemically fabricated (e.g. by EFAB ™) from at least onestructural material (e.g. nickel), at least one sacrificial material(e.g. copper), and at least one sealing material (e.g. solder). Thelayered structure is made to have a desired configuration which is atleast partially and immediately surrounded by sacrificial material whichis in turn surrounded almost entirely by structural material. Thesurrounding structural material includes openings in the surface throughwhich etchant can attack and remove trapped sacrificial material foundwithin. Sealing material is located near the openings. After removal ofthe sacrificial material, the box is evacuated or filled with a desiredgas or liquid. Thereafter, the sealing material is made to flow, sealthe openings, and resolidify. US App. No. 10/434,497 Multistep ReleaseMethod for Electrochemically Fabricated Structures May 7, 2003Multilayer structures are electrochemically fabricated (e.g. by EFAB ™)from at least one structural material (e.g. nickel), that is configuredto define a desired structure and which may be attached to a supportstructure, and at least a first sacrificial material (e.g. copper) thatsurrounds the desired structure, and at least one more material whichsurrounds the first sacrificial material and which will function as asecond sacrificial material. The second sacrificial material is removedby an etchant and/or process that does not attack the first sacrificialmaterial. Intermediate post processing activities may occur, and thenthe first sacrificial material is removed by an etchant or process thatdoes not attack the at least one structural material to complete therelease of the desired structure.

[0118] Various other embodiments of the present invention exist. Some ofthese embodiments may be based on a combination of the teachings hereinwith various teachings incorporated herein by reference. Someembodiments may not use any blanket deposition process and/or they maynot use a planarization process. Some embodiments may involve theselective deposition of a plurality of different materials on a singlelayer or on different layers. Some embodiments may use blanketdepositions processes that are not electrodeposition processes. Someembodiments may use selective deposition processes on some layers thatare not conformable contact masking processes and are not evenelectrodeposition processes. Some embodiments may use nickel as astructural material while other embodiments may use different materialssuch as copper, gold, silver, or any other electrodepositable materialsthat can be separated from the a sacrificial material. Some embodimentsmay use copper as the structural material with or without a sacrificialmaterial. Some embodiments may remove a sacrificial material while otherembodiments may not. In some embodiments the sacrificial material may beremoved by a chemical etching operation, an electrochemical operation,or a melting operation. In some embodiments the anode may be differentfrom the conformable contact mask support and the support may be aporous structure or other perforated structure. Some embodiments may usemultiple conformable contact masks with different patterns so as todeposit different selective patterns of material on different layersand/or on different portions of a single layer. In some embodiments, thedepth of deposition will be enhanced by pulling the conformable contactmask away from the substrate as deposition is occurring in a manner thatallows the seal between the conformable portion of the CC mask and thesubstrate to shift from the face of the conformal material to the insideedges of the conformable material.

[0119] In view of the teachings herein, many further embodiments,alternatives in design and uses of the instant invention will beapparent to those of skill in the art. As such, it is not intended thatthe invention be limited to the particular illustrative embodiments,alternatives, and uses described above but instead that it be solelylimited by the claims presented hereafter.

We claim:
 1. An alignment and/or retention structure for receiving aplurality of components, comprising: a base; a plurality of alignmentand/or retention fixtures attached to the base and having desiredpositions relative to one another, wherein one or more of the followingconditions is met: (1) the base and the alignment and/or retentionfixtures are substantially monolithic, (2) the alignment and/orretention fixtures comprise at least one material deposited as aplurality of layers, or (3) the alignment and/or retention fixtures areformed in a single process in their respective relative positions. 2.The structure of claim 1 wherein the base and at least a portion of thealignment and/or retention fixtures are connected by a deformablematerial that allows fine adjustments of the fixtures relative to thebase to be made to optimize alignment and/or retention of components. 3.The structure of claim 1 wherein the deformable material comprises a lowmelting point metal that can be heated to allow deformation.
 4. Thestructure of claim 2 wherein the deformable material is a material thatcomprises a structural configuration that allows relatively easydeformation along at least one axis.
 5. The structure of claim 1 whereinat least one alignment and/or retention fixture comprises at least onestop in a direction of motion parallel to a plane of a surface of thebase.
 6. The structure of claim 1 wherein at least one alignment and/orretention fixture comprises at least one stop in a direction of motionperpendicular to a plane of a surface of the base.
 7. The structure ofclaim 1 wherein at least one retention fixture comprises at leaststructure for retaining a component in a desired position.
 8. Thestructure of claim 1 wherein at least one alignment and/or retentionfixture comprises a structure for guiding a component to a desiredposition.
 9. The structure of claim 1 wherein at least a first alignmentand/or retention fixture is located at a first surface of the base andat least a second alignment and/or retention fixture is located at asecond surface of the base.
 10. The structure of claim 1 wherein thebase comprises an opening that extends from one surface to anothersurface and through which material or information may pass to or from acomponent aligned or retained relative thereto.
 11. The structure ofclaim 1 wherein at least one alignment and/or retention fixture iscapable of receiving a secondary alignment and/or retention fixture towhich a component may be aligned and/or retained.
 12. The structure ofclaim 1 wherein the alignment and/or retention fixtures comprise amaterial deposited on substantially a layer-by-layer basis or thealignment and/or retention fixtures are formed in a single process intheir respective relative positions, and wherein the structure comprisestwo or more conductive paths separated from one another by a dielectric,wherein at least one of the paths meets at least one of the followingcriteria: (1) the at least one path forms a connection between at leasttwo electrical contact points on a single component; (2) the at leastone path forms a connection between electrical contact points on atleast two different components; (3) the at least one path allows anelectrical connection to be made from the structure to a separatestructure; (4) the structure is adapted to be located in a substantiallyhermetic package and the at least one path allows an electricalconnection to be made from the structure to a separate structure that isexternal to the package; (5) the at least one path makes an electricalconnection to an electrically functional device that was formed alongwith the structure; or (6) the at least one path comprises a componentthat guides and/or modifies an RF or microwave signal.
 13. The structureof claim 1 wherein at least a portion of at least one alignment and/orretention fixture contacts the at least one dielectric region and atleast a portion of at least one alignment and/or retention fixturecontacts the at least one conductive region.
 14. The structure of claim1 wherein the structure is capable of receiving photonic components forforming a photonics device.
 15. The structure of claim 14 wherein thephotonics components include at least one optical generation, detection,or manipulation device.
 16. The structure of claim 1 wherein thefixtures are adapted to align and/or retain at least one of (1) anelectronic component; (2) an electrical component; (3) a componentcapable of controlling or directing the flow of a liquid or a gas; or(4) a component for modifying, controlling, or detecting temperature.17. The structure of claim 1 wherein the structure is adapted to engagewith a housing structure.
 18. The structure of claim 1 wherein thestructure comprises elements that provide an electrical functional, athermodynamic function, an optical or photonic function, and/or amechanical function.
 19. The structure of claim 1 wherein the structurecomprises at least one fixture having a retention functionalitycomprising at least one of: (1) a pivotable structure that includes aretention arm and an actuation arm that move substantially inconjunction with one another, (2) a retention arm that slides over thecomponent and holds one side while the opposite side is held, at leastin part, by the elastomeric deformation of a compression element, or (3)a retention arm that engages a side of a component and inhibits thecomponent from backing out in a direction opposite to a loadingdirection and a stop component that inhibits further inward loading ofthe component.
 20. The structure of claim 1 whose production comprisesone or more of the following operations: (1) selectivelyelectrodepositing a first conductive material and electrodepositing asecond conductive material, wherein one of the first or secondconductive materials is a sacrificial material and the other is astructural material; (2) electrodepositing a first conductive material,selectively etching the first structural material to create at least onevoid, and electrodepositing a second conductive material to fill the atleast one void; (3) electrodepositing at least one conductive material,depositing at least one flowable dielectric material, and depositing aseed layer of conductive material in preparation for formation of a nextlayer of electrodeposited material, and/or (4) selectivelyelectrodepositing a first conductive material, then electrodepositing asecond conductive material, then selectively etching one of the first orsecond conductive materials, and then electrodepositing a thirdconductive material, wherein at least one of the first, second, or thirdconductive materials is a sacrificial material and at least one of theremaining two conductive materials is a structural material.
 21. Adevice, comprising: (a) an alignment and/or retention structure,comprising: (1) a base; (2) a plurality of alignment and/or retentionfixtures adhered to the base and having desired positions relative toone another; (b) a plurality of components mounted on the alignmentstructure in positions dictated by the alignment and/or retentionfixtures, wherein one or more of the following conditions are met:wherein one or more of the following conditions are met: (1) the baseand the alignment and/or retention fixtures are monolithic, (2) thealignment and/or retention fixtures comprise a material deposited onsubstantially a layer-by-layer basis, or (3) the alignment and/orretention fixtures are formed in a single process in their respectiverelative positions.
 22. The device of claim 21 wherein the base and atleast a portion of the alignment and/or retention fixtures are connectedby a deformable material that allows fine adjustments of the fixturesrelative to the base to be made to optimize alignment and/or retentionof components.
 23. The device of claim 21 wherein the deformablematerial comprises a low melting point metal that can be heated to allowdeformation.
 24. The device of claim 23 wherein the deformable materialis a material that comprises a structural configuration that allowsrelatively easy deformation along at least one axis.
 25. The device ofclaim 21 wherein at least one alignment and/or retention fixturecomprises at least one stop in a direction of motion parallel to a planeof a surface of the base.
 26. The device of claim 21 wherein at leastone alignment and/or retention fixture comprises at least one stop in adirection of motion perpendicular to a plane of a surface of the base.27. The device of claim 21 wherein at least one retention fixturecomprises at least structure for retaining a component in a desiredposition.
 28. The device of claims 21 wherein at least one alignmentand/or retention fixture comprises a structure for guiding a componentto a desired position.
 29. The device of claim 21 wherein at least afirst alignment and/or retention fixture is located at a first surfaceof the base and at least a second alignment and/or retention fixture islocated at a second surface of the base.
 30. The device of claim 21wherein the base comprises an opening that extends from one surface toanother surface and through which material or information may pass to orfrom a component aligned or retained relative thereto.
 31. The device ofclaim 21 wherein at least one alignment and/or retention fixture iscapable of receiving a secondary alignment and/or retention fixture towhich a component may be aligned and/or retained.
 32. The device ofclaim 21 wherein the alignment and/or retention fixtures comprise amaterial deposited on substantially a layer-by-layer basis or thealignment and/or retention fixtures are formed in a single process intheir respective relative positions, and wherein the structure comprisestwo or more conductive paths separated from one another by a dielectric,wherein at least one of the paths meets at least one of the followingcriteria: (1) the at least one path forms a connection between at leasttwo electrical contact points on a single component; (2) the at leastone path forms a connection between electrical contact points on atleast two different components; (3) the at least one path allows anelectrical connection to be made from the structure to a separatestructure; (4) the structure is located in a substantially hermeticpackage and the at least one path allows an electrical connection to bemade from the structure to a separate structure that is external to thepackage; (5) the at least one path makes an electrical connection to anelectrically functional device that was formed along with the structure;(6) the at least one path comprises a component that guides and/ormodifies an RF or microwave signal.
 33. The device of claim 21 whereinat least a portion of at least one alignment and/or retention fixturecontacts the at least one dielectric region and at least a portion of atleast one alignment and/or retention fixture contacts the at least oneconductive region.
 34. The device of claim 21 wherein the structure hasreceived photonic components for forming a photonics device.
 35. ′ Thedevice of claim 34 wherein the photonics components include at least oneoptical generation, detection, or manipulation device.
 36. The device ofclaim 21 wherein the fixtures align and/or retain at least one of (1) anelectronic component; (2) an electrical component; (3) a componentcapable of controlling or directing the flow of a liquid or a gas; or(4) a component for modifying, controlling, or detecting temperature.37. The device of claims 21 wherein the structure is engaged with ahousing structure for forming a substantially hermetic cavity around atleast a portion of one surface of the base.
 38. The device of claim 21wherein the structure comprises elements that provide an electricalfunctional, a thermodynamic function, an optical or photonic function,and/or a mechanical function.
 39. The device of claim 21 wherein thestructure comprises at least one fixture having a retentionfunctionality comprising one of: (1) a pivotable structure that includesa retention arm and an actuation arm that move substantially inconjunction with one another, (2) a retention arm that slides over thecomponent and holds one side while the opposite side is held, at leastin part, by the elastomeric deformation of a compression element, or (3)a retention arm that engages a side of a component and inhibits thecomponent from backing out in a direction opposite to a loadingdirection and a stop component that inhibits further inward loading ofthe component.
 40. The device of claim 21, wherein production of atleast a portion of the device comprises one or more of the followingoperations: (1) selectively electrodepositing a first conductivematerial and electrodepositing a second conductive material, wherein oneof the first or second conductive materials is a sacrificial materialand the other is a structural material; (2) electrodepositing a firstconductive material, selectively etching the first structural materialto create at least one void, and electrodepositing a second conductivematerial to fill the at least one void; (3) electrodepositing at leastone conductive material, depositing at least one flowable dielectricmaterial, and depositing a seed layer of conductive material inpreparation for formation of a next layer of electrodeposited material,and/or (4) selectively electrodepositing a first conductive material,then electrodepositing a second conductive material, then selectivelyetching one of the first or second conductive materials, and thenelectrodepositing a third conductive material, wherein at least one ofthe first, second, or third conductive materials is a sacrificialmaterial and at least one of the remaining two conductive materials is astructural material.